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Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes

Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes

Nombre De La Marca: ZMSH
MOQ: 1
Precio: by case
Detalles Del Embalaje: Cartones personalizados
Condiciones De Pago: T/T
Información detallada
Lugar de origen:
PORCELANA
Conductividad térmica:
Alto (campo uniforme)
Resistencia/arrastre de alta temperatura:
Excelente
Choque térmico:
Excelente
Temperatura de uso continuo máximo:
1250 ° C
CVD SIC recubrimiento/impurezas de la superficie:
< 5 ppm
Aspereza de la pared interior:
RA ≤ 0.8–1.6 µm (esmalte fino / casi espeluznante opcional)
Capacidad de la fuente:
Por caso
Descripción de producto

 

Product Positioning & Value Proposition

The Silicon Carbide (SiC) Horizontal Process Tube is the primary pressure boundary and clean process chamber used in high-temperature gas-phase reactions and heat treatment for semiconductor, photovoltaic, and advanced materials manufacturing.


The product adopts a 3D-printed monolithic SiC body + CVD SiC functional coating architecture, combining high thermal conductivity, low contamination, high mechanical strength, and chemical durability. It is optimized for processes that demand low particle/gas contamination, excellent temperature uniformity, and long-term stability.

Core value:

  • Push the tool’s temperature uniformity, cleanliness, and OEE to a higher level.

  • Extend replacement intervals and shorten cleaning downtime to optimize Total Cost of Ownership (TCO).

  • Provide a long-life, low-risk chamber solution for oxidative and chlorine-bearing chemistries at elevated temperature.

Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes 0 


 

Applicable Atmospheres & Process Window

  • Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes 1Working atmospheres

    • Reactive gases: oxygen (O₂) and other oxidizing mixtures

    • Carrier/protective gases: nitrogen (N₂) and high-purity inert gases

    • Compatible species: trace chlorine-bearing gases (concentration and residence time controlled by recipe)

  • Typical processes: dry/wet oxidation, anneal, diffusion, LPCVD/CVD deposition, surface activation/modification, PV passivation, functional thin-film formation, carbonization/nitridation, etc.

  • Temperature range: ambient to 1250 °C (recommend 10–15% safety margin depending on heater design and ΔT constraints)

  • Pressure range: from slight vacuum/LPCVD negative pressure to near-atmospheric positive pressure (final rating per PO/spec).


 

Materials & Structural Rationale

  1. Monolithic SiC body (additive manufactured)

    • High-density β-SiC or multi-phase SiC; single-piece construction eliminates seams and braze joints that can create micro-leaks or stress concentrators.

    • High thermal conductivity (vs. alumina/quartz) supports rapid thermal response and improved axial/radial uniformity.

    • Low, stable CTE yields better high-temperature dimensional stability and seal integrity.

  2. CVD SiC functional coating

    • In-situ deposited, dense and ultra-pure (surface/coating impurities < 5 ppm); minimizes particle shedding and metal ion release.

    • Outstanding chemical inertness toward oxidizing and chlorine-bearing gases; mitigates wall attack and re-deposition.

    • Zonal thickness tailoring available to balance corrosion resistance with thermal response.

  3. Composite benefits

    • Body provides mechanical support + heat conduction; coating provides corrosion resistance + cleanliness—a system-level optimum for reliability and throughput.


 

Key Performance Targets 

  • Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes 2Max continuous use temperature: 1250 °C

  • Substrate (bulk body) total impurities: < 300 ppm

  • CVD SiC coating/surface impurities: < 5 ppm

  • Dimensional tolerances (typical): OD ±0.3–0.5 mm; coaxiality ≤ 0.3 mm/m (tighter upon request)

  • Inner-wall roughness: Ra ≤ 0.8–1.6 µm (fine polish / near-mirror optional)

  • Leak tightness (helium): ≤ 1×10⁻⁹ Pa·m³/s (per tool class)

  • Thermal shock stability: supports repeated hot-cold cycling with no visible cracking or spallation (type-test report supplied)

  • Cleanliness: final clean/assembly in ISO Class 5–6 environment; particle and metal ion residues certified per customer spec.


 

Configurations & Options

  • Silicon Carbide (SiC) Horizontal Process Tube for LPCVD/CVD Processes 3Geometry: OD 50–400 mm (larger on evaluation), long-length one-piece bodies; wall thickness optimized for strength/weight/heat flux.

  • Ends & interfaces: flanges, bell-mouth, bayonet, locating rings, O-ring grooves, pump-out/pressure ports—tailored to your frames/jigs.

  • Functional ports: thermocouple feedthrough preparation, sight window seats, bypass gas inlets (all with high-temp, leak-tight design).

  • Coating strategies: inner wall (default), outer wall, or full coverage; local shielding/graded thickness for high-impingement zones.

  • Surface & cleanliness: roughness grade, ultrasonic/DI clean, drying/bake curves configurable.

  • Ancillaries: graphite/ceramic/metal flanges, seals, locating fixtures, handling sleeves and storage cradles.

 


 

Comparison

Metric SiC Tube Quartz Tube Alumina Tube Graphite Tube
Thermal conductivity High (uniform field) Low Low High
High-temp strength/creep Excellent Fair Good Good (oxidation-sensitive)
Thermal shock Excellent Weak Moderate Excellent
Cleanliness / metal ions Excellent (low) Moderate Moderate Poor
Oxidation & Cl-chemistry Excellent Fair Good Poor (oxidizes)
Cost vs. service life Medium / long life Low / short Medium / medium Medium / env-limited

 

 


 

Frequently Asked Questions (FAQ)

Q1. Why monolithic 3D-printed SiC?
A. Eliminates seams/brazes that cause leaks and stress peaks; enables complex geometries with repeatable dimensions.

 

Q2. Will Cl-bearing gases attack SiC?
A. CVD SiC is highly inert to most Cl species within specified temperature/partial pressure/residence limits. Use local thickening in high-impingement zones and ensure robust purge/exhaust design.

 

Q3. What are the practical gains vs. quartz?
A. Longer life, better uniformity, lower particles/metal ions, and better TCO—especially above ~900 °C and in oxidizing/Cl environments.

 

Q4. Is fast ramping supported?
A. Yes, with controlled max ΔT and rates; pair high-κ body + thin coating, and follow first-use bake SOP.

 

Q5. When should a tube be retired?
A. Trigger on any of: flange/edge cracks, coating pits/spall, rising leak rate, drifted temperature profile, abnormal particle events.