Vidrio de vía de vidrio (TGV)

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Vidrio de vía de vidrio (TGV)

Otros vídeos

May 31, 2024

Conexión De Categoría: substrato del zafiro

Chatea Contáctenos

Etiquetas:

#oblea del zafiro #substrato de silicio #material del zafiro

Resumen: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.

Características De Productos Relacionados:

Enables device miniaturization with compact interconnect solutions.
Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
Superior high-frequency characteristics ideal for RF applications.
Precise via pitch tolerance of less than ±20μm per 200mm wafer.
Adaptable para obleas de hasta 200 mm de diámetro.
Laser-induced etching ensures crack-free blind and through vias.
High aspect ratios and high-density vias for modern technology demands.
Widely used in high-performance computing, 5G, IoT, and sensor packaging.

Las preguntas:

What is Through Glass Via (TGV) technology?

TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
¿Cuáles son las aplicaciones del TGV en semiconductores?

En semiconductores, la tecnología TGV se utiliza para la integración de alta densidad, el rendimiento de alta frecuencia y la estabilidad térmica y mecánica mejorada en aplicaciones como 5G, IoT y el empaquetado de sensores.
What materials are compatible with TGV technology?

TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.