Sistema de aserradura de diamantes de varios alambres para materiales frágiles de SiC / zafiro / ultra-duro

Chatea Contáctenos

Sistema de aserradura de diamantes de varios alambres para materiales frágiles de SiC / zafiro / ultra-duro

Otros vídeos

August 19, 2025

Conexión De Categoría: equipo de laboratorio científico

Chatea Contáctenos

Etiquetas:

#metro ultravioleta de la transmitencia #Metro ligero de la transmitencia #metro de la transmisión ligera

Resumen: Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.

Características De Productos Relacionados:

High-throughput cutting with wire speeds up to 1500 m/min, enabling 50-200 slices per operation.
Precision control with ±0.005 mm positioning accuracy and closed-loop wire tension control.
Flexible modular design supporting wire diameters from 0.12-0.45 mm for various cutting stages.
Industrial durability with a rigid machine frame and ceramic-coated guide wheels for >8000 hours of service life.
Intelligent control system with real-time monitoring, recipe storage, and remote monitoring functions.
High-pressure cooling and multi-stage filtration for effective debris removal and thermal management.
Wide application range including semiconductors, photovoltaics, LED, and advanced ceramics.
Max. work size of 220×200×350 mm for square and Φ205×350 mm for round workpieces.

Las preguntas:

¿Qué materiales puede cortar el sistema de aserradura de diamantes de varios alambres?

Está diseñado para materiales ultra duros y frágiles como SiC, GaN, zafiro, cuarzo, cerámica y silicio mono/policristalino, ampliamente utilizados en semiconductores, fotovoltaicos, LED,y cerámica avanzada.
How does the Multi-Wire Diamond Sawing System compare to single-wire saws?

It offers 5-10× higher throughput, cutting dozens to hundreds of wafers per cycle, with kerf loss <100 μm, increasing material utilization by 30-40%, while maintaining high precision (±0.02 mm) and excellent surface quality (Ra <0.5 μm).
What is the maximum processing capacity of the machine?

The machine can handle square workpieces up to 220 × 200 × 350 mm and round workpieces up to Φ205 × 350 mm, with wire speeds up to 1500 m/min, producing 50-200 slices per run depending on material and wire diameter.

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